Air Liquide has secured a long-term agreement with SK hynix to support advanced HBM semiconductor packaging in South Korea. The nearly EUR 200 million investment includes a new nitrogen production facility and strengthens the company's position in the fast-growing AI-driven semiconductor manufacturing market.
Air Liquide has won a long-term supply contract from SK hynix to provide critical industrial gases and high-purity compressed air for a new semiconductor packaging and testing facility in Cheongju, South Korea. To support the project, Air Liquide plans to invest nearly EUR 200 million in a dedicated nitrogen production unit scheduled to enter service in late 2027. The project will serve SK hynix’s P&T7 facility, which is focused on advanced packaging of High-Bandwidth Memory (HBM) chips.
HBM technology has become increasingly important as demand rises for artificial intelligence applications, data centers, and high-performance computing systems. The development underscores growing investment across the semiconductor supply chain as manufacturers expand capacity for AI-related components.
Industrial gas suppliers, equipment providers, and advanced manufacturing service companies are expected to benefit from continued growth in memory and packaging technologies across Asia. According to company disclosures, the contract also marks an early strategic outcome from Air Liquide’s acquisition of DIG Airgas, a leading industrial gas provider in South Korea. The combination enhances Air Liquide’s regional capabilities and strengthens its presence in the Cheongju industrial cluster, where it already supports semiconductor production activities.
Air Liquide is a France-based industrial gases and services company serving sectors including electronics, healthcare, manufacturing, and energy. SK hynix is one of the world's largest memory semiconductor manufacturers and a major supplier of DRAM and NAND products used in computing and AI infrastructure.
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