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Doosan expands advanced electronic material production to supply AI data center market

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Doosan expands advanced electronic material production to supply AI data center market
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Doosan is committing 970 billion won through 2028 to expand production lines for high-performance copper-clad laminate (CCL). Facilities in South Korea and China will address surging demand from AI data center equipment manufacturers.

CHINA; KOREA (SOUTH) South Korean conglomerate Doosan is undertaking a 970 billion won capital expenditure program through 2028 to increase its production capacity for premium copper-clad laminate (CCL). The multi-phase expansion plan allocates 420 billion won to domestic facilities in South Korea for optical module materials and 550 billion won toward building a dedicated manufacturing plant in China aimed at supply for AI accelerators and network switches. Both regional expansion projects are projected to begin commercial operations during the second half of 2028.

Copper-clad laminate functions as a foundational material for printed circuit boards, facilitating high-speed electronic signal transmission required across advanced computing platforms. Rapid capital deployment into artificial intelligence infrastructure and data center construction has driven unprecedented demand for these high-spec electronic components. Existing production lines in South Korea have been operating above full capacity, prompting proactive supply chain investment following earlier facility announcements in Thailand.

Headquartered in Seoul, South Korea, Doosan Corp. is a diversified multinational corporation operating in heavy industry, energy, industrial equipment, and advanced electronic materials. The group specializes in specialized industrial materials and power components servicing international technology markets.

This strategic investment highlights the critical role of specialized upstream component suppliers within the global hardware value chain. By dividing production between South Korea and China, the strategy balances domestic intellectual property protection and high-end technical expertise with geographic proximity to high-volume printed circuit board manufacturers across Asia. The expanded capacity aims to mitigate supply bottleneck risks for hyperscalers, server manufacturers, and telecommunications providers expanding next-generation computing infrastructure.

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